Микропроцессорный лазерный датчик ZX-L

Diffuse-reflective

Spot beam

40±10 mm

2 µm

39 × 33 × 17

ZX-LD40

100±40 mm

16 µm

ZX-LD100

300±200 mm

300 µm

ZX-LD300

Line beam

40±10 mm

2 µm

ZX-LD40L

100±40 mm

16 µm

ZX-LD100L

300±200 mm

300 µm

ZX-LD300L

Regular reflection type

Spot beam

30±2 mm

0.25 µm

45 × 55 × 25

ZX-LD30V

Line beam

ZX-LD30VL

Optical method

Diffuse reflection

Regular 
reflection

Diffuse reflection

Regular 
reflection

Light source (wave length)

Visible-light semiconductor laser (wavelength 650 nm, 1 mW or less, Class 2)

Measurement center distance

40 mm

100 mm

300 mm

30 mm

40 mm

100 mm

300 mm

30 mm

Measurement range

±10 mm

±40 mm

±200 mm

±2 mm

±10 mm

±40 mm

±200 mm

±2 mm

Beam shape

Spot

Line

Beam diameter

50 µm dia.

100 µm dia.

300 µm dia.

75 µm dia.

75 µmx2mm

150 µmx2 mm

450 µmx2 mm

100 µmx1.8 mm

Resolution

2 µm

16 µm

300 µm

0.25 µm

2 µm

16 µm

300 µm

0.25 µm

Linearity

±0.2% F.S. 
(entire range)

±0.2% F.S. 
(80 to 121 mm)

±2% F.S. 
(200 to 401 mm)

±0.2% F.S. 
(entire range)

±0.2% F.S.
(32 to 49 mm)

±0.2% F.S. 
(80 to 121 mm)

±2% F.S. 
(200 to 401 mm)

±0.2% F.S. 
(entire range)

Temperature characteristic

±0.03% FS/°C (except for ZX-LD300 and ZX-LD300L, which are ±0.1% FS/°C.)

Ambient illumination

Incandescent lamp: 3,000 lx max. (on light receiving side)

Ambient temperature

Operating: 0 to 50°C, storage: -15 to 60°C (with no icing or condensation)

Ambient humidity

Operating and storage: 35% to 85% (with no condensation)

Insulation resistance

20 MΩ min. at 500 VDC

Dielectric strength

1,000 VAC, 50/60 Hz for 1 min

Vibration resistance 
(destruction)

10 to 150 Hz, 0.7-mm double amplitude 80 min each in X, Y, and Z directions

Shock resistance 
(destruction)

300 m/s2 3 times each in six directions (up/down, left/right, forward/backward)

Protective structure

IEC 60529 IP50

IEC standard IP40

IEC 60529 IP50

IEC standard IP40

Connection method

Connector relay (standard cable length: 500 mm)

Weight (packed state)

Approx. 150 g

Approx. 250 g

Approx. 150 g

Approx. 250 g

Materials

Case: PBT (polybutylene terephthalate), 
Cover: Aluminum, lens: Glass

Case and cover: Aluminum, lens: Glass

Case: PBT (polybutylene terephthalate), 
Cover: Aluminum, lens: Glass

Case and cover: Aluminum, lens: Glass

Accessories

Instruction sheet, Laser warning label (English)

Optical method

Through-beam

Light source (wave length)

Visible-light semiconductor laser (wavelength 650 nm, 1 mW or less, Class 1)

Maximum output

0.2 mW max.

0.35 mW max.

0.2 mW max.

Measurement width

1 mm dia.

1 to 2.5 mm dia.

5 mm

10 mm

30 mm

Sensing distance

0 to 500 mm

500 to 2,000 mm

0 to 500 mm

Min. sensing object

8 mm dia. opaque object

8 to 50 µm opaque object

opaque: 0.05 mm dia.

opaque: 0.1 mm dia.

opaque: 0.3 mm dia.

Resolution

4 µm

-

4 µm

12 µm

Temperature characteristic

±0.2% FS/°C

±0.3% FS/°C

Ambient illumination

Incandescent lamp: 10,000 lx max. (on light-receiving side)

Ambient temperature

Operating: 0 to 50°C, storage: -25 to 70°C (with no icing or condensation)

Ambient humidity

Operating: 35% to 85% (with no condensation)

Protective structure

IEC 60529 IP40

IP 40

Connection method

Connector relay (standard cable length: 500 mm)

Weight (packed state)

Approx. 220 g

Approx. 450 g

Cable length

Extendable up to 10 m with special extension cable.

Materials

Case

Polyetherimide

Zinc die-cast

Cover

Polycarbonate

Front filter

Glass

Tightening torque

0.3 Nm max.

Accessories

Instruction sheet, sensor head-amplifier connection cable

Optical axis adjustment seal

Mounting Bracket